ZHENGZHOU HENGTONG FURNACE CO,. LTD
High Temperature Compact Vacuum Hot Flat Press for Wafer Bonding
  • High Temperature Compact Vacuum Hot Flat Press for Wafer Bonding
  • High Temperature Compact Vacuum Hot Flat Press for Wafer Bonding
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High Temperature Compact Vacuum Hot Flat Press for Wafer Bonding

This is a Compact Vacuum Hot Flat Press for wafer welding or film transfer. The maximum sample size is 50mm x 50mm x 15mm. The superior performance of the equipment is very suited for sintered bonding research of third-generation semiconductor devices. The maximum operating temperature is 500°C and the maximum pressure is 5000N. It is fully satisfied with the need for packaging interconnection materials in the process of semiconductor preparation. The vacuum and atmosphere environment provided by it can reduce the oxidation of materials as much as possible. It is a very cost-effective laboratory R & D equipment.

This is a Compact Vacuum Hot Flat Press for wafer welding or film transfer. The maximum sample size is 50mm x 50mm x 15mm. The superior performance of the equipment is very suited for sintered bonding research of third-generation semiconductor devices. The maximum operating temperature is 500°C and the maximum pressure is 5000N. It is fully satisfied with the need for packaging interconnection materials in the process of semiconductor preparation. The vacuum and atmosphere environment provided by it can reduce the oxidation of materials as much as possible. It is a very cost-effective laboratory R & D equipment.

Specifications

Power

110V-280V selectable,50/60 Hz

Heating Plates

Both heating plates are made of heat-resistant stainless steel and built inside the vacuum chamber.

Heating Plates500C(<30min

Continuous Working Temperature:450C

Heating Rate:10C/min

Flatness 0.005mm

Max Sample Size:50mm*50mm*15mm

Heat Power:200W

Temp.Controller

Two Precision digital temperature controllers independently control up and bottom heating plates.

Maximum of 30 programmable segments to control heating,dwelling,and cooling.

Temperature accuracy:±1C,±3C at 500C

Pressing system

Max Pressure:500Kg/5000N at 500C

Dual Mode Electric Oil-Free Press(30mm stroke)

Constant Pressure Duration:1-9999 minutes

Pressure Display Range:1-500Kg

Vacuum Chamber

Made of 304 stainless steel With stiffer welded to prevent deformation.

Mechanical Pressure Gauge:-0.1-0.15MPa

4inch Observation Window

Dimensions

Main:220*130*700mm(L*W*H) Control Box:340*300*140mm(L*W*H)

Net Weight

45Kg

Warranty

Lifetime support

One-year limited standard warranty(extend the warranty to 5 years at an extra cost)

Graphite rods are not covered by a warranty.

Note:If you have any questions, please contact us.

This is a Compact Vacuum Hot Flat Press for wafer welding or film transfer. The maximum sample size is 50mm x 50mm x 15mm. The superior performance of the equipment is very suited for sintered bonding research of third-generation semiconductor devices. The maximum operating temperature is 500°C and the maximum pressure is 5000N. It is fully satisfied with the need for packaging interconnection materials in the process of semiconductor preparation. The vacuum and atmosphere environment provided by it can reduce the oxidation of materials as much as possible. It is a very cost-effective laboratory R & D equipment.

Specifications

Power

110V-280V selectable,50/60 Hz

Heating Plates

Both heating plates are made of heat-resistant stainless steel and built inside the vacuum chamber.

Heating Plates500C(<30min

Continuous Working Temperature:450C

Heating Rate:10C/min

Flatness 0.005mm

Max Sample Size:50mm*50mm*15mm

Heat Power:200W

Temp.Controller

Two Precision digital temperature controllers independently control up and bottom heating plates.

Maximum of 30 programmable segments to control heating,dwelling,and cooling.

Temperature accuracy:±1C,±3C at 500C

Pressing system

Max Pressure:500Kg/5000N at 500C

Dual Mode Electric Oil-Free Press(30mm stroke)

Constant Pressure Duration:1-9999 minutes

Pressure Display Range:1-500Kg

Vacuum Chamber

Made of 304 stainless steel With stiffer welded to prevent deformation.

Mechanical Pressure Gauge:-0.1-0.15MPa

4inch Observation Window

Dimensions

Main:220*130*700mm(L*W*H) Control Box:340*300*140mm(L*W*H)

Net Weight

45Kg

Warranty

Lifetime support

One-year limited standard warranty(extend the warranty to 5 years at an extra cost)

Graphite rods are not covered by a warranty.

Note:If you have any questions, please contact us.