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High heating rate Rapid Thermal Process Ovens with 200K/sec Ramp up Rate
  • High heating rate Rapid Thermal Process Ovens with 200K/sec Ramp up Rate
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High heating rate Rapid Thermal Process Ovens with 200K/sec Ramp up Rate

The Rapid Thermal Process Ovens (RTP) has a heating rate of 200K/sec and is a device that can achieve rapid sample heating and precise temperature control in a very short period of time. This high-speed heating capability gives it significant advantages in fields such as semiconductor manufacturing and material research, greatly reducing process time, minimizing thermal budget, reducing thermal damage to materials, and improving production efficiency and product performance.

The Rapid Thermal Process Ovens (RTP) has a heating rate of 200K/sec and is a device that can achieve rapid sample heating and precise temperature control in a very short period of time. This high-speed heating capability gives it significant advantages in fields such as semiconductor manufacturing and material research, greatly reducing process time, minimizing thermal budget, reducing thermal damage to materials, and improving production efficiency and product performance.

 

Specifications

Type

RTP 100

RTP 150

Max temperature

1000

1200

Vacuum capable

Up to 10-3 hPa

Chamber material

Aluminium chamber and quartz glass universal holder

Process Chamber

Quartz glass chamber

Chamber height

18mm

Vacuum capacity

Up to 10-3hpa,RTP-100-HV up to 10-6hpa

Temperature max.

1200

Heating

Top and bottom heating with 18 IR Lamps(20KW)

Chamber cooling

Water cooled

Substrate Cooling

By nitrogen gas

Process chamber

134*169*18mm(W*D*H)

Electric connection

400/230V,20kw

Weight

55kg

Flow controller

Mass flow controller

Max Past size

100mm dia.(4’’)

 

Features

1. Excellent temperature uniformity up to 4 gas lines

2. Heated by 2×24 IR infrared Lamps

3. Flow controller for 5nlmvacuum

 


The Rapid Thermal Process Ovens (RTP) has a heating rate of 200K/sec and is a device that can achieve rapid sample heating and precise temperature control in a very short period of time. This high-speed heating capability gives it significant advantages in fields such as semiconductor manufacturing and material research, greatly reducing process time, minimizing thermal budget, reducing thermal damage to materials, and improving production efficiency and product performance.

 

Specifications

Type

RTP 100

RTP 150

Max temperature

1000

1200

Vacuum capable

Up to 10-3 hPa

Chamber material

Aluminium chamber and quartz glass universal holder

Process Chamber

Quartz glass chamber

Chamber height

18mm

Vacuum capacity

Up to 10-3hpa,RTP-100-HV up to 10-6hpa

Temperature max.

1200

Heating

Top and bottom heating with 18 IR Lamps(20KW)

Chamber cooling

Water cooled

Substrate Cooling

By nitrogen gas

Process chamber

134*169*18mm(W*D*H)

Electric connection

400/230V,20kw

Weight

55kg

Flow controller

Mass flow controller

Max Past size

100mm dia.(4’’)

 

Features

1. Excellent temperature uniformity up to 4 gas lines

2. Heated by 2×24 IR infrared Lamps

3. Flow controller for 5nlmvacuum